(footprint "TI_DCT0008A_SSOP8_3x3mm_P0.65mm" (version 20250114) (generator pcbnew) (layer "F.Cu")
 (descr "TI DCT0008A 4220784/D 10/2025 example land pattern, pads 1.1x0.4, row centers3.8, pitch0.65; factory DFM pending")
 (attr smd)
 (property "Reference" "REF**" (at 0 -2.4) (layer "F.SilkS") (effects (font (size 0.8 0.8) (thickness 0.12))))
 (property "Value" "DCT0008A" (at 0 2.4) (layer "F.Fab") (effects (font (size 0.8 0.8) (thickness 0.12))))
 (fp_rect (start -1.55 -1.55) (end 1.55 1.55) (stroke (width 0.1) (type default)) (fill none) (layer "F.Fab"))
 (fp_line (start -1.55 -1.05) (end -1.05 -1.55) (stroke (width 0.1) (type default)) (layer "F.Fab"))
 (fp_line (start -1.55 -1.75) (end 1.55 -1.75) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
 (fp_line (start -1.55 1.75) (end 1.55 1.75) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
 (fp_circle (center -2.8 -1.6) (end -2.7 -1.6) (stroke (width 0.12) (type default)) (fill none) (layer "F.SilkS"))
 (fp_rect (start -2.95 -1.85) (end 2.7 1.85) (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd"))
(pad "1" smd roundrect (at -1.9 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "2" smd roundrect (at -1.9 -0.32499999999999996) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "3" smd roundrect (at -1.9 0.32500000000000007) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "4" smd roundrect (at -1.9 0.9750000000000002) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "5" smd roundrect (at 1.9 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "6" smd roundrect (at 1.9 0.32499999999999996) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "7" smd roundrect (at 1.9 -0.32500000000000007) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
(pad "8" smd roundrect (at 1.9 -0.9750000000000002) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.125) (solder_mask_margin 0.05))
)
