TPS22992x 5-V, 8.7-mΩ, 6-A Load Switch With Adjustable Rise Time
1 Features
•
Input operating voltage range (VIN):
–
TPS22992: 0.1 V to 5.5 V
–
TPS22992S: 1 V to 5.5 V
•
Bias voltage supply (VBIAS): 1.5 V to 5.5 V
•
Maximum continuous current: 6 A
•
On-resistance (RON): 8.7 mΩ (typ.)
•
Adjustable slew rate control
•
Adjustable quick output discharge (QOD)
•
Open drain Power Good (PG) signal
•
Low power consumption:
–
ON state (IQ): 10 µA (typ.) for TPS22992
–
ON state (IQ): 30 µA (typ.) for TPS22992S
–
OFF state (ISD): 0.1 µA (typ.)
•
Short circuit protection (TPS22992S only)
•
Thermal shutdown
•
Smart ON pin pulldown (RPD,ON)
–
ON ≥ VIH (ION): 25 nA (typ.)
–
ON ≤ VIL (RPD,ON): 500 kΩ (typ.)
2 Applications
•
Data storage
•
PC & notebooks
•
Industrial PC
•
Optical module
TPS22992x Block Diagram
3 Description
The TPS22992x product family consists of two 
devices: TPS22992 and TPS22992S. Each device is 
a single-channel load switch with an 8.7-mΩ power 
MOSFET designed to maximize power density in 
applications up to 5.5 V and 6 A. A configurable 
rise time provides flexibility for power sequencing and 
minimizes inrush current for high capacitance loads.
The switch is controlled by an enable pin (ON), which 
is capable of interfacing directly with low voltage 
GPIO signals (VIH = 0.8 V). The TPS22992x device 
has an optional QOD pin for quick output discharge 
when switch is turned off, and the fall time (tFALL) 
of the output can be adjusted through an external 
resistor. There is a Power Good (PG) signal on the 
device that indicates when the main MOSFET is fully 
turned on, which can be used to enable a downstream 
load.
Both 
TPS22992x 
devices 
come 
with 
thermal 
shutdown to ensure protection in high temperature 
environments. The TPS22992S device also integrates 
overcurrent protection, preventing damage to the 
device if the output is shorted to ground during 
operation or start-up.
For small form factor applications, the TPS22992x 
devices are available in a 1.25 × 1.25mm, 0.4-mm 
pitch, 8-pin WQFN package. The TPS22992 device is 
also available in a 1.5 × 1.25 mm, 0.5-mm pitch, 8-pin 
WQFN package where a wider pin pitch is needed. 
Both devices are characterized for operation over the 
free-air temperature range of –40°C to +125°C.
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
TPS22992
WQFN - 8 (RXP)
1.5 mm × 1.25 mm
TPS22992S
WQFN - 8 (RXN)
1.25 mm × 1.25 mm
(1)
For all available packages, see the orderable addendum at 
the end of the data sheet.
TPS2299x Application for Power Sequencing
TPS22992
SLVSFT0A – JULY 2021 – REVISED DECEMBER 2021
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, 
intellectual property matters and other important disclaimers. PRODUCTION DATA.

Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics (VBIAS = 5 V)..................... 6
7.6 Electrical Characteristics (VBIAS = 3.3 V).................. 7
7.7 Electrical Characteristics (VBIAS = 1.5 V).................. 7
7.8 Switching Characteristics (VBIAS = 5 V).................... 8
7.9 Switching Characteristics (VBIAS = 3.3 V)................. 9
7.10 Switching Characteristics (VBIAS = 1.5 V)............. 10
7.11 Typical Characteristics.............................................11
8 Timing Diagram............................................................. 13
9 Detailed Description......................................................14
9.1 Overview...................................................................14
9.2 Functional Block Diagram.........................................14
9.3 Feature Description...................................................15
9.4 Device Functional Modes..........................................16
10 Application and Implementation................................17
10.1 Application Information........................................... 17
10.2 Typical Application.................................................. 17
11 Power Supply Recommendations..............................19
12 Layout...........................................................................20
12.1 Layout Guidelines................................................... 20
12.2 Layout Example...................................................... 20
13 Device and Documentation Support..........................21
13.1 Receiving Notification of Documentation Updates..21
13.2 Support Resources................................................. 21
13.3 Trademarks.............................................................21
13.4 Electrostatic Discharge Caution..............................21
13.5 Glossary..................................................................21
14 Mechanical, Packaging, and Orderable 
Information.................................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (July 2021) to Revision A (December 2021)
Page
•
Changed status from "Advance Information" to "Production Data".....................................................................1
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5 Device Comparison Table
DEVICE
VIN RANGE
RON AT VBIAS = 5 V
QUIESCENT 
CURRENT
PACKAGE 
DIMENSIONS
PIN PITCH
TPS22992RXP
0.1 V to 5.5 V
8.7 mΩ
10 μA
1.5 mm x 1.25 mm
0.5 mm
TPS22992SRXN
1 V to 5.5 V
8.7 mΩ
40 μA
1.25 mm x 1.25 mm
0.4 mm
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6 Pin Configuration and Functions
Figure 6-1. TPS22992x Pinout (Top View Left, Bottom View Right)
Table 6-1. Pin Functions
PIN
I/O(1)
DESCRIPTION
NAME
NO.
VBIAS
1
I
Bias voltage
VIN
2
I
Input voltage
PG
3
O
Open drain power good signal, asserted high when the output is full load ready
GND
4
—
Device ground
QOD
5
—
Quick output discharge pin
VOUT
6
O
Output voltage
CT
7
O
Timing pin, can control the slew rate of the output through a capacitor to GND
ON
8
I
Enable pin
(1)
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VIN
Input Voltage
–0.3
6
V
VBIAS
Bias Voltage
–0.3
6
V
VON, VPG, VQOD Control Pin Voltage
–0.3
6
V
VCT
CT Pin Voltage
15
V
IMAX
Maximum Current
6
A
TJ
Junction temperature
Internally 
Limited
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress 
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated 
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device 
reliability.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001(1)
±2000
V
Charged device model (CDM), per ANSI/ESDA/
JEDEC JS-002(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
TPS22992 Input Voltage
0.1
VBIAS
V
TPS22992S Input Voltage
1
VBIAS
V
VBIAS
Bias Voltage
1.5
5.5
V
VIH
ON Pin High Voltage Range
0.8
5.5
V
VIL
ON Pin Low Voltage Range
0
0.35
V
VPG, VQOD
Control Pin Voltage
0
5.5
V
TA
Ambient Temperature
–40
125
°C
7.4 Thermal Information
THERMAL METRIC (1)
TPS22992
UNIT
RXP (WQFN)
RXN (WQFN)
8 PINS
8 PINS
RθJA 
Junction-to-ambient thermal resistance
110.0
119.4
°C/W
ΨJT
Junction-to-top characterization parameter
6.8
6.9
°C/W
YJB
Junction-to-board characterization parameter
36.6
35.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application 
report.
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7.5 Electrical Characteristics (VBIAS = 5 V)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C and VIN = 5V.
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
Power Consumption
ISD,VBIA
S
VBIAS Shutdown Current
ON = 0 V
25°C
0.1
uA
–40°C to 85°C
0.25
uA
–40°C to 125°C
0.36
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992)
ON > VIH
25°C
10
uA
–40°C to 85°C
16
uA
–40°C to 125°C
20
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992S)
ON > VIH
25°C
30
uA
–40°C to 85°C
45
uA
–40°C to 125°C
50
uA
ISD,VIN
VIN Shutdown Current
ON = 0 V
–40°C to 125°C
0.1
uA
ION
ON pin leakage
ON = VBIAS
–40°C to 125°C
0.1
uA
Performance
RON
On-Resistance
VIN = 5 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
14
mΩ
VIN = 3.3 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
15
mΩ
VIN = 1.8 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
14
mΩ
VIN = 1.2 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
14
mΩ
VIN = 0.8 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
14
mΩ
VOL,PG
Power Good VOL
IPG = 1 mA
–40°C to 125°C
0.2
V
RPD,ON
Smart Pull Down Resistance
ON < VIL
25°C
500
kΩ
–40°C to 125°C
1000
kΩ
RQOD
QOD Resistance
ON < VIL
25°C
25
Ω
RQOD
–40°C to 125°C
100
Ω
Protection
ISC,H
Short Circuit Current Limit (High)
VOUT ≤ VIN - 1.5 V
–40°C to 125°C
11
A
ISC,L
Short Circuit Current Limit (Low)
VOUT ≤ VSC
–40°C to 125°C
1.5
A
tSC
Short Circuit Response Time
VIN = 1 V to 5.5 V
–40°C to 125°C
5
μs
VSC
Short Circuit Detection Threshold
VOUT voltage level, rising
–40°C to 125°C
0.45
V
VOUT voltage level, falling
–40°C to 125°C
0.35
V
TSD
Thermal Shutdown
-
170
°C
TSDHYS Thermal Shutdown Hysteresis
-
20
°C
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7.6 Electrical Characteristics (VBIAS = 3.3 V)
over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C and VIN = 3.3V.
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
Power Consumption
ISD,VBIA
S
VBIAS Shutdown Current
ON = 0 V
25°C
0.1
uA
–40°C to 85°C
0.2
uA
–40°C to 125°C
0.27
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992)
ON > VIH
25°C
10
uA
–40°C to 85°C
15
uA
–40°C to 125°C
16
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992S)
ON > VIH
25°C
26
uA
–40°C to 85°C
42
uA
–40°C to 125°C
45
uA
ISD,VIN
VIN Shutdown Current
ON = 0 V
–40°C to 125°C
0.1
uA
ION
ON pin leakage
ON = VBIAS
–40°C to 125°C
0.1
uA
Performance
RON
On-Resistance
VIN = 3.3 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
15
mΩ
VIN = 1.8 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
15
mΩ
VIN = 1.2 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
15
mΩ
VIN = 0.8 V
25°C
8.7
mΩ
–40°C to 85°C
12
mΩ
–40°C to 125°C
15
mΩ
VOL,PG
Power Good VOL
IPG = 1 mA
–40°C to 125°C
0.2
V
RPD,ON
Smart Pull Down Resistance
ON < VIL
25°C
500
kΩ
–40°C to 125°C
1000
kΩ
RQOD
QOD Resistance
ON < VIL
25°C
25
Ω
–40°C to 125°C
100
Ω
Protection
ISC,H
Short Circuit Current Limit (High)
VOUT ≤ VIN - 1.5 V
–40°C to 125°C
10
A
ISC,L
Short Circuit Current Limit (Low)
VOUT ≤ VSC
–40°C to 125°C
1.5
A
tSC
Short Circuit Response Time
VIN = 1 V to 5.5 V
–40°C to 125°C
5
μs
VSC
Short Circuit Detection Threshold
VOUT voltage level, rising
–40°C to 125°C
0.45
V
VOUT voltage level, falling
–40°C to 125°C
0.35
V
TSD
Thermal Shutdown
-
170
°C
TSDHYS Thermal Shutdown Hysteresis
-
20
°C
7.7 Electrical Characteristics (VBIAS = 1.5 V)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C and VIN = 1.5V.
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
Power Consumption
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7.7 Electrical Characteristics (VBIAS = 1.5 V) (continued)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C and VIN = 1.5V.
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
ISD,VBIA
S
VBIAS Shutdown Current
ON = 0 V
25°C
0.1
uA
–40°C to 85°C
0.2
uA
–40°C to 125°C
0.25
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992)
ON > VIH
25°C
8
uA
–40°C to 85°C
12
uA
–40°C to 125°C
14
uA
IQ,VBIAS
VBIAS Quiescent Current 
(TPS22992S)
ON > VIH
25°C
22
uA
–40°C to 85°C
29
uA
–40°C to 125°C
31
uA
ISD,VIN
VIN Shutdown Current
ON = 0 V
–40°C to 125°C
0.1
uA
ION
ON pin leakage
ON = VBIAS
–40°C to 125°C
0.1
uA
Performance
RON
On-Resistance
VIN = 1.5 V
25°C
12.7
mΩ
–40°C to 85°C
21
mΩ
–40°C to 125°C
27
mΩ
VIN = 1.2 V
25°C
11.2
mΩ
–40°C to 85°C
18
mΩ
–40°C to 125°C
25
mΩ
VIN = 0.8 V
25°C
10
mΩ
–40°C to 85°C
16
mΩ
–40°C to 125°C
23
mΩ
VOL,PG
Power Good VOL
IPG = 1 mA
–40°C to 125°C
0.2
V
RPD,ON
Smart Pull Down Resistance
ON < VIL
25°C
500
kΩ
–40°C to 125°C
1000
kΩ
RQOD
QOD Resistance
ON < VIL
25°C
25
Ω
–40°C to 125°C
100
Ω
Protection
ISC,H
Short Circuit Current Limit (High)
VOUT ≤ VIN - 1.5 V
–40°C to 125°C
10
A
ISC,L
Short Circuit Current Limit (Low)
VOUT ≤ VSC
–40°C to 125°C
1.5
A
tSC
Short Circuit Response Time
VIN = 1 V to 5.5 V
–40°C to 125°C
5
μs
VSC
Short Circuit Detection Threshold
VOUT voltage level, rising
–40°C to 125°C
0.45
V
VOUT voltage level, falling
–40°C to 125°C
0.35
V
TSD
Thermal Shutdown
-
170
°C
TSDHYS Thermal Shutdown Hysteresis
-
20
°C
7.8 Switching Characteristics (VBIAS = 5 V)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 5V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1980
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1430
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
554
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
224
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.3
us
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7.8 Switching Characteristics (VBIAS = 5 V) (continued)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 3.3V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1480
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
962
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
517
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
218
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
14.8
us
VIN = 1.8V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1040
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
553
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
489
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
220
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.2
us
VIN = 1.2V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
862
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
386
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
476
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
221
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.5
us
VIN = 0.8V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
743
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
282
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
462
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
222
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
16.4
us
7.9 Switching Characteristics (VBIAS = 3.3 V)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 3.3V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1560
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1010
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
547
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
224
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
14.1
us
VIN = 1.8V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1090
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
581
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
505
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
223
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.1
us
VIN = 1.2V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
903
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
406
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
498
us
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7.9 Switching Characteristics (VBIAS = 3.3 V) (continued)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
223
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.3
us
VIN = 0.8V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
774
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
284
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
489
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
222
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
15.1
us
7.10 Switching Characteristics (VBIAS = 1.5 V)
Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 1.5V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
1040
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
501
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
542
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
225
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
13.4
us
VIN = 1.2V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
959
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
421
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
538
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
221
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
13.9
us
VIN = 0.8V
tON
Turn ON time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
840
us
tRISE
Rise time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
314
us
tD
Delay time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
526
us
tFALL
Fall time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
218
us
tOFF
Turn OFF time
RL = 10 Ω, CL = 10 uF, CT = 1000 pF
14.8
us
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7.11 Typical Characteristics
Bias Voltage (V)
Quiescent Current (uA)
1.5
2
2.5
3
3.5
4
4.5
5
5.5
15
17
19
21
23
25
27
29
31
33
35
–40C
25C
85C
125C
VIN = VBIAS
VOUT = Open
Figure 7-1. Quiescent Current vs Bias Voltage
Bias Voltage (V)
Shutdown Current (uA)
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
2
4
6
8
10
12
14
16
18
20
–40C
25C
85C
125C
VIN = VBIAS
VOUT = GND
Figure 7-2. VBIAS Shutdown Current vs Bias Voltage
Bias Voltage (V)
On-Resistance (m)
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
2
4
6
8
10
12
14
16
18
–40C
25C
85C
125C
VIN = VBIAS
IOUT = 200 mA
Figure 7-3. ON-Resistance vs Bias Voltage
Input Voltage (V)
Rise Time (us)
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
–40C
25C
125C
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-4. Rise Time vs Input Voltage
Input Voltage (V)
Delay Time (us)
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
300
350
400
450
500
550
600
650
700
750
800
–40C
25C
125C
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-5. Delay Time vs Input Voltage
Input Voltage (V)
Turn-on Time (us)
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
250
500
750
1000
1250
1500
1750
2000
2250
2500
–40C
25C
125C
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-6. Turn-On Time vs Input Voltage
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7.11 Typical Characteristics (continued)
Input Voltage (V)
Fall Time (us)
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
200
210
220
230
240
250
260
270
280
290
300
–40C
25C
125C
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-7. Fall Time vs Input Voltage
Input Voltage (V)
Turn-Off Time (us)
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
10
12
14
16
18
20
22
24
26
28
30
–40C
25C
125C
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-8. Turn-Off Time vs Input Voltage
CT Capacitor (pF)
Rise Time (us)
0
500 1000 1500 2000 2500 3000 3500 4000 4500 5000
0
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
6500
VIN = 5 V
VIN = 3.3 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 0.8 V
VBIAS = 5 V
RL = 10 Ω
CL = 10 μF
Figure 7-9. Rise Time vs CT Capacitance
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8 Timing Diagram
Figure 8-1. TPS22992x Timing Parameters
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9 Detailed Description
9.1 Overview
The TPS22992 and TPS22992S devices are both single-channel load switches with an 8.7-mΩ power MOSFET 
designed to operate up to 6 A. The voltage range of the TPS22992 device is 0.1 V to 5.5 V, and the voltage 
range of the TPS22992S device is 1 V to 5.5 V. A configurable rise time provides flexibility for power sequencing 
and minimizes inrush current for high capacitance loads.
The switch is controlled by an enable pin (ON), which is capable of interfacing directly with low voltage GPIO 
signals down to its VIH level of 0.8 V. The TPS22992x device has an optional QOD pin for quick output discharge 
when switch is turned off, and the fall time (tFALL) of the output can be adjusted through an external resistor. 
There is a Power Good (PG) signal on the device that indicates when the main MOSFET is fully turned on and 
the on-resistance is at its final value.
Both TPS22992x devices come with thermal shutdown to ensure protection in high temperature environments. 
The TPS22992S also integrates overcurrent protection, preventing damage to the device if the output is shorted 
to ground during operation or start-up.
9.2 Functional Block Diagram
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9.3 Feature Description
9.3.1 ON and OFF Control
The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold so it 
can be used in a wide variety of applications. When power is first applied to VIN, a Smart Pulldown is used to 
keep the ON pin from floating until the system sequencing is complete. After the ON pin is deliberately driven 
high (≥ VIH), the Smart Pulldown is disconnected to prevent unnecessary power loss. See the below table when 
the ON Pin Smart Pulldown is active.
ON Pin Voltage
ON Pin Function
≤ VIL
Pulldown active
≥ VIH
No pulldown
9.3.2 Adjustable Quick Output Discharge
The TPS22992x device includes a QOD feature that can be configured in one of three ways:
•
QOD pin shorted to VOUT pin. Using this method, the discharge rate after the switch becomes disabled 
is controlled with the value of the internal resistance RQOD. The value of this resistance is listed in the 
Electrical Characteristics table.
•
QOD pin connected to VOUT pin using an external resistor REXT. After the switch becomes disabled, the 
discharge rate is controlled by the value of the total resistance of the QOD.
•
QOD pin is unused and left floating. Using this method, there is no quick output discharge functionality, and 
the output remains floating after the switch is disabled.
Fall time is dependent on the strength of the configured pulldown resistance on the output.
9.3.3 Adjustable Slew Rate
A capacitor to GND on the CT pin sets the slew rate, and the higher the capacitance the lower the slew rate. The 
voltage on the CT pin can be as high as 15 V; therefore, the minimum voltage rating for the CT capacitor must 
be 30 V for optimal performance. Rise times for VBIAS = 5 V are shown below.
CT Capacitor
VIN = 5 V
VIN = 3.3 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 0.8 V
0 pF
147 µs
113 µs
77 µs
59 µs
45 µs
220 pF
426 µs
297 µs
179 µs
129 µs
94 µs
1000 pF
1430 µs
962 µs
553 µs
386 µs
282 µs
4700 pF
6130 µs
4090 µs
2330 µs
1640 µs
1180 µs
The following equation can be used to estimate the rise time for different VIN and CT capacitors at VBIAS = 5 V.
tR = VIN × (0.27 × CT + 25.5) + 24.9
(1)
Where:
•
tR = Rise time in µs
•
VIN = Input voltage in V
•
CT = CT capacitance in pF
9.3.4 Power Good (PG) Signal
The TPS22992x device has a Power Good (PG) output signal to indicate the gate of the pass FET is driven high 
and the switch is on with the on-resistance close to its final value (full load ready). The signal is an active high 
and open drain output which can be connected to a voltage source through an external pullup resistor, RPU. This 
voltage source can be VOUT from the TPS22992x device or another external voltage. VBIAS is required for PG 
to have a valid output.
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9.3.5 Thermal Shutdown
When the device temperature reaches 170°C (typical), the device shuts itself off to prevent thermal damage. 
After the device cools off by about 20°C, it turns back on. If the device is kept in a thermally stressful 
environment, then the device oscillates between these two states until it can keep its temperature below the 
thermal shutdown point.
9.3.6 Short Circuit Protection (TPS22992S)
The device limits current to the output in case of output shorts. When a short occurs, the large VIN to VOUT 
voltage drop causes the switch to limit the output current (ISC). When the output is below the short circuit 
threshold (VSC), a lower limit is used to minimize the power dissipation while the fault is present. The device 
continues to limit the current until it reaches its thermal shutdown temperature. At this time, the device turns off 
until its temperature has lowered by the thermal hysteresis (20°C typical) before turning on again.
Figure 9-1. Output Short Circuit Current Limiting
Figure 9-2. Output Short Circuit Response
9.4 Device Functional Modes
The below table summarizes the device functional modes.
ON
Fault Condition
VOUT State
L
N/A
Hi-Z
H
None
VIN (through RON)
H
Output short
Current limited (TPS22992S)
X
Thermal shutdown
Hi-Z
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10 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, 
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for 
determining suitability of components for their purposes, as well as validating and testing their design 
implementation to confirm system functionality.
10.1 Application Information
This section highlights some of the design considerations when implementing this device in various applications.
10.2 Typical Application
This typical application demonstrates how the TPS22992x device can be used to limit start-up inrush current.
Figure 10-1. TPS22992x Typical Application
10.2.1 Design Requirements
For this example, the values below are used as the design parameters.
Table 10-1. Design Parameters
PARAMETER
VALUE
VBIAS
5 V
VIN
5 V
CL
47 uF
Maximum acceptable inrush current
200 mA
10.2.2 Detailed Design Procedure
When the switch is enabled, the output capacitance must be charged up from 0 V to the set value (5 V in this 
example). This charge arrives in the form of inrush current. Inrush current can be calculated using the equation 
below.
Inrush Current = CL × dVOUT/dt
(2)
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Where:
•
CL is the output capacitance.
•
dVOUT is the change in VOUT during the ramp up of the output voltage when device is enabled.
•
dt is the rise time in VOUT during the ramp up of the output voltage when the device is enabled.
The TPS22992 offers an adjustable rise time for VOUT, allowing the user to control the inrush current during 
turn-on. The appropriate rise time can be calculated using the design requirements and the inrush current 
equation as shown below.
200 mA = 47 µF × 5 V/dt
(3)
dt = 1175 µs
(4)
To ensure an inrush current of less than 200 mA, a CT value that yields a rise time of more than 1175 µs must be 
chosen. See the oscilloscope captures in the Application Performance Plots section for an example of how the 
CT capacitor can be used to reduce inrush current.
10.2.3 Application Performance Plots
The below oscilloscope captures show the difference between the inrush current for CT = 0 pF and CT = 1000 pF 
settings. The CT = 1000 pF setting is able to keep the inrush current under the required 200 mA, while the CT = 0 
pF setting is too fast for this design.
Figure 10-2. Inrush Current for CL = 47 µF with CT = 
0 pF
Figure 10-3. Inrush Current for CL = 47 µF with CT = 
1000 pF
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11 Power Supply Recommendations
The TPS22992 device is designed to operate with a VIN range of 0.1 V to 5.5 V, and the TPS22992S device 
over a range of 1 V to 5.5 V. The VIN power supply must be well regulated and placed as close to the device 
terminal as possible. The power supply must be able to withstand all transient load current steps. In most 
situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent the supply voltage from dipping when 
the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large 
load current step, additional bulk capacitance can be required on the input.
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12 Layout
12.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output 
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances can have 
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.
12.2 Layout Example
Figure 12-1. TPS22992x Layout Example
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13 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, 
generate code, and develop solutions are listed below.
13.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on 
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For 
change details, review the revision history included in any revised document.
13.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight 
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do 
not necessarily reflect TI's views; see TI's Terms of Use.
13.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled 
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may 
be more susceptible to damage because very small parametric changes could cause the device not to meet its published 
specifications.
13.5 Glossary
TI Glossary 
This glossary lists and explains terms, acronyms, and definitions.
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most 
current data available for the designated devices. This data is subject to change without notice and revision of 
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Nov-2025
PACKAGING INFORMATION
Orderable part number
Status
(1)
Material type
(2)
Package | Pins
Package qty | Carrier
RoHS
(3)
Lead finish/
Ball material
(4)
MSL rating/
Peak reflow
(5)
Op temp (°C)
Part marking
(6)
TPS22992RXPR
Active
Production
WQFN-HR (RXP) | 8
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
MC
TPS22992RXPR.A
Active
Production
WQFN-HR (RXP) | 8
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
MC
TPS22992SRXNR
Active
Production
WQFN-HR (RXN) | 8
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
MB
TPS22992SRXNR.A
Active
Production
WQFN-HR (RXN) | 8
3000 | LARGE T&R
Yes
SN
Level-1-260C-UNLIM
-40 to 125
MB
 
(1) Status:  For more details on status, see our product life cycle.
 
(2) Material type:  When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
 
(3) RoHS values:  Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
 
(4) Lead finish/Ball material:  Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
 
(5) MSL rating/Peak reflow:  The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
 
(6) Part marking:  There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
 
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.
 
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.
 
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
 
Addendum-Page 1

PACKAGE MATERIALS INFORMATION
 
 
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0
 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
User Direction of Feed
P1
Reel
Diameter
 
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS22992RXPR
WQFN-
HR
RXP
8
3000
180.0
8.4
1.45
1.7
0.95
4.0
8.0
Q1
TPS22992SRXNR
WQFN-
HR
RXN
8
3000
180.0
8.4
1.45
1.45
0.95
4.0
8.0
Q2
Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
 
 
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
 
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22992RXPR
WQFN-HR
RXP
8
3000
210.0
185.0
35.0
TPS22992SRXNR
WQFN-HR
RXN
8
3000
210.0
185.0
35.0
Pack Materials-Page 2

NOTES:
1.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2.
This drawing is subject to change without notice.
PACKAGE OUTLINE
4225934/A   05/2020
www.ti.com
WQFN-HR - 0.8 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RXP0008A 
A
0.08 C
B
SYMM
SYMM
PIN 1 INDEX AREA
1.35
1.15
1.6
1.4
0.8 MAX
0.05
0.00
SEATING PLANE
C
2X 0.6
0.4
4X 0.3
0.2
8X 0.3
0.2
0.1
C A B
0.05
C
(0.1) TYP
3
2X
1
4X
0.5
4
5
7
8
1
2X 0.425
0.325

EXAMPLE BOARD LAYOUT
4225934/A   05/2020
www.ti.com
WQFN-HR - 0.8 mm max height
RXP0008A 
PLASTIC QUAD FLATPACK- NO LEAD
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE: 35X
NOTES: (continued)
3.
For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) .
4.
Solder mask tolerances between and around signal pads can vary based on board fabrication site.
NON- SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
EXPOSED METAL
METAL
SOLDER MASK
OPENING
METAL
EXPOSED METAL
SOLDER MASK
OPENING
(1.2)
(0.95)
(1.325)
4X (0.5)
4X (0.45)
8X (0.25)
2X (0.7)
2X (0.575)
3
4
5
7
8
1
(R0.05) TYP

EXAMPLE STENCIL DESIGN
4225934/A   05/2020
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WQFN-HR - 0.8 mm max height
RXP0008A 
PLASTIC QUAD FLATPACK- NO LEAD
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 35X
NOTES: (continued)
5.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate 
design recommendations.
SYMM
SYMM
(1.2)
(0.95)
(1.325)
4X (0.5)
4X (0.45)
8X (0.25)
2X (0.7)
2X (0.575)
(R0.05) TYP
3
4
5
7
8
1

NOTES:
1.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2.
This drawing is subject to change without notice.
PACKAGE OUTLINE
4225935/A   05/2020
www.ti.com
WQFN-HR - 0.8 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RXN0008A
A
0.08 C
0.1
C A B
0.05
C
B
SYMM
SYMM
PIN 1 INDEX AREA
1.35
1.15
1.35
1.15
0.8 MAX
0.05
0.00
SEATING PLANE
C
2X 0.8
2X 0.6
0.4
6X 0.25
0.15
6X 0.3
0.2
2X 0.3
0.2
4X 0.4
0.1
C A B
0.05
C
(0.1) TYP
2
3
5
6
7
1

EXAMPLE BOARD LAYOUT
4225935/A   05/2020
www.ti.com
WQFN-HR - 0.8 mm max height
RXN0008A
PLASTIC QUAD FLATPACK- NO LEAD
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE: 35X
NOTES: (continued)
3.
For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) .
4.
Solder mask tolerances between and around signal pads can vary based on board fabrication site.
NON- SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
EXPOSED METAL
METAL
SOLDER MASK
OPENING
METAL
EXPOSED METAL
SOLDER MASK
OPENING
4X (0.4)
0.95
1.2
6X (0.45)
6X (0.2)
2X (0.7)
2X (0.25)
2
3
5
6
7
1
(R0.05) TYP

EXAMPLE STENCIL DESIGN
4225935/A   05/2020
www.ti.com
WQFN-HR - 0.8 mm max height
RXN0008A
PLASTIC QUAD FLATPACK- NO LEAD
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 35X
NOTES: (continued)
5.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate 
design recommendations.
SYMM
SYMM
4X (0.4)
0.95
1.2
6X (0.45)
6X (0.2)
2X (0.7)
2X (0.25)
2
3
5
6
7
1
(R0.05) TYP

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