Drill report for airpump.kicad_pcb
Created on 2026-09-13T19:02:31

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  In1.Cu                    in1
    L3 :  In2.Cu                    in2
    L4 :  B.Cu                      back


Drill file 'airpump-PTH.drl' contains
    plated through holes:
    =============================================================
    T1  0.300mm  0.0118"  (316 holes))
    T2  0.600mm  0.0236"  (12 holes))
    T3  0.750mm  0.0295"  (19 holes))
    T4  1.000mm  0.0394"  (5 holes))
    T5  1.100mm  0.0433"  (20 holes))
    T6  1.700mm  0.0669"  (6 holes))

    Total plated holes count 378


Drill file 'airpump-NPTH.drl' contains
    unplated through holes:
    =============================================================
    T1  3.200mm  0.1260"  (4 holes))

    Total unplated holes count 4
