BGA & Advanced Package PCB Assembly
Reliable placement and inspection for hidden-joint devices — from fine-pitch BGAs to power packages.
Assembly for hidden solder joints
BGA, LGA, CSP, and fine-pitch QFN devices need correct pad design, paste volume, reflow profile, and post-reflow inspection. We combine SPI, AOI, and X-ray to catch voids, bridges, and alignment issues.
Rework and reball support can be discussed for approved programs.
- BGA/LGA/QFN placement and reflow
- 2D/3D X-ray for void and joint quality
- Stencil design and aperture review
- Nitrogen reflow where required
- IPC-A-610 workmanship targets
How we run your program
Pad geometry, via-in-pad, and thermal relief review.
SPI verifies volume before placement.
Profile tuned per package and board mass.
AOI plus X-ray sampling or 100% per spec.
Frequently asked questions
Inspection depth follows your quality plan — sampling or 100% X-ray can be agreed at quote stage.
Yes, subject to DFM review; we confirm feasibility with your Gerber and BOM.
Rework may be available for approved programs; include requirements in your inquiry.
Related guides
Request a quote
Send Gerber, BOM, and quantities to hello@pcbapartner.com — typical response within 24–48 hours.
Get a Quote