Match assembly limits to layout
Fine-pitch ICs, 01005/0201 passives, BGA/QFN/LGA packages, and connector density are reviewed against process controls.
Manufacturing Capabilities
Capabilities Mapped to
Manufacturing Risk.
Use this page to connect technical limits, inspection depth, equipment evidence, and volume planning to the decisions in your RFQ package.
Capability principles
Capability only matters when it maps to project risk.
Instead of treating every machine or process as a claim, this page organizes capability around the practical questions buyers ask before release: package difficulty, volume path, test depth, and documentation scope.
Plan prototype to repeat builds
NPI notes, first-article findings, fixture readiness, and material decisions should transfer into stable production.
Define inspection by risk
AOI, SPI, X-ray, ICT, FCT, programming, and coating checks are selected by package type and product use case.
Make capability reviewable
Equipment photos, report samples, process notes, and release packets turn capacity into evidence buyers can inspect.
Core Services
What We Build
A comprehensive suite of assembly and manufacturing services — all under one roof, all held to the same uncompromising standard.
01 Product Definition
Product Concept, Appearance & Structure Design
Support from product idea to industrial appearance direction, enclosure structure, internal stack-up, assembly feasibility, and prototype-ready mechanical files.
02 Prototype / NPI
Prototype & NPI Services
Fast engineering samples with DFM/DFA review, BOM risk feedback, first-article inspection, and production notes that transfer cleanly into pilot builds.
03 SMT Assembly
SMT Assembly
High-speed surface-mount production for fine-pitch passives, QFN, BGA, LED, IoT, and industrial boards with controlled printing, placement, reflow, SPI, and AOI checks.
04 THT / Mixed Build
THT / Through-Hole Assembly
Wave, selective, and skilled manual soldering for connectors, terminals, relays, transformers, displays, and high-mechanical-load components after SMT placement.
05 Specialty Assembly
Flex & Rigid-Flex PCB Assembly
Fixture-supported assembly for flexible and rigid-flex boards, including handling control, bend-area protection, controlled reflow, and connector alignment checks.
06 Box Build / Test
Box Build, Testing & Quality Records
Move from assembled boards to product-ready delivery with cable work, enclosure integration, programming, ICT/FCT support, labeling, packing, and release documentation.
Capability-to-Service Links
Match technical capability to the RFQ path buyers search for
These links connect manufacturing capability with the service and industry pages that explain sourcing model, inspection depth, and buyer documentation.
Turnkey PCBA Assembly in China
From file review to testing and export logistics, one accountable path for global sourcing teams.
Services
SMT / THT Assembly Services
Surface-mount, through-hole, mixed technology, BGA/QFN, and production assembly scope.
Services
Box Build Assembly
Move from assembled boards to enclosure, cable, label, package, and final product integration.
Services
BGA PCB Assembly
Define inspection evidence, void limits, and shipment release records for hidden-joint assemblies.
Services
Industrial Control PCBA
High-mix, long-lifecycle boards for PLC, power, gateway, sensor, and automation products.
Services
Medical Device PCBA
Traceability, FOD control, inspection records, and test packets for regulated electronics.
Services
RFQ Package Checklist
Gerber, BOM, centroid, drawings, quantities, test requirements, and delivery notes.
Services
Automotive PCBA Manufacturing
Lifecycle change control and release documentation support for vehicle electronics.
Services
Prototype PCB Assembly
Engineering-first production for fast validation, ECO traceability, and smooth pilot transitions.
Services
Consigned / Kitted PCB Assembly
Mixed-supply flow with incoming inspection, shortage feedback, and substitution control.
Services
Factory Evidence
Manufacturing Capabilities Buyers Can Verify
This section turns capability claims into checkable production facts: line setup, inspection path, test scope, and the evidence assets that should be attached when available.
FacilityDongguan electronics manufacturing site, stated as 2,000 m² on the site.
SMT capacityFive SMT lines with screen printing, placement, reflow, SPI/AOI process checks.
Assembly rangeSMT, THT, BGA/QFN/LGA, flex/rigid-flex, prototype, low-volume, and repeat builds.
Test pathAOI/SPI, X-ray planning, ICT/FCT, programming, fixture and release record support by project scope.
Capability
What a buyer can ask to verify
Evidence window
SMT line
Line photo, equipment nameplate, feeder setup photo, reflow profile example, first-article checklist.
SMT line, printer, SPI, or station photos.
BGA / Fine pitch
Package list, stencil review note, MSL handling rule, X-ray sampling or 100% inspection criteria.
X-ray image and hidden-joint inspection report.
ICT / FCT
Fixture photo, test procedure cover page, pass/fail log format, programming version control.
Test bench, fixture photo, and pass/fail log example.
Case scene
Representative project type, quantity range, inspection depth, test scope, and release packet example.
Anonymized case scenario and release record example.
Representative photos are used here for capability review. For customer RFQs, attach project-specific line, fixture, inspection, or release-record evidence when available.
Equipment Proof
Equipment List and Machine Evidence Windows
Buyers can use this section to understand what proof is useful during capability review: equipment category, process role, inspection method, and photo evidence where project details can be shared.
Equipment category
Details buyers should verify
Evidence window
SMT line set
Printer, SPI, mounter, reflow, AOI model, quantity, line number, board size range, and maintenance/calibration status.
Line panorama + equipment nameplates.
X-Ray / BGA inspection
Machine model, inspection mode, image output format, sampling rule, void/bridge acceptance note, and reviewer role.
X-ray station photo + anonymized BGA image.
ICT / FCT / programming
Fixture type, supported node count or test scope, firmware/version control, pass/fail log example, and release criteria.
Fixture/test bench photo + log screenshot.
Material control
MSL storage, baking equipment, incoming inspection tools, ESD controls, reel/kitting workflow, and lot traceability fields.
Warehouse/MSL cabinet/IQC photos.
Do not publish serial numbers or customer program details if they are sensitive. Keep enough data visible for buyers to verify process maturity: category, model family, date, line/station, and acceptance status.
Facility Deep Dive
Inside Our Manufacturing Lines
Purpose-built production lines, maintained to the highest standards, with real-time data collection at every stage.
SMT Lines
5 Fully Automated SMT Lines
Each of our five high-speed SMT lines runs a closed-loop process chain: screen printer → 3D SPI → pick-and-place → nitrogen reflow oven → 3D AOI. Real-time SPC data is fed back to upstream machines automatically.
- Yamaha YSM40R high-speed mounters
- DEK Horizon screen printers with vision alignment
- 10-zone nitrogen reflow ovens
- Closed-loop SPC feedback control
- Full MES traceability on every board
Testing & Inspection
Multi-Stage Verification at Every Step
A dedicated inspection zone sits between every major process step. Our engineers review AOI escapes and X-Ray images daily, feeding findings back into our process control database to prevent recurrence.
- 100% inline 3D AOI post-reflow
- X-Ray for all BGA & hidden-joint components
- Flying probe & bed-of-nails ICT
- Customer-defined functional test (FCT)
- Burn-in & environmental stress screening
Supply Chain
Trusted Global Component Sourcing
Our procurement team maintains relationships with 200+ authorized distributors globally — including Avnet, Arrow, Mouser, and Digi-Key — ensuring genuine parts, competitive pricing, and no end-of-life surprises.
- Authorized distributor partnerships
- Anti-counterfeit verification (AS6081)
- MSD baking per JEDEC J-STD-033
- Bonded inventory program available
- Long-lead-time risk mitigation planning
From Order to Delivery
Our Production Workflow
A transparent, milestone-driven process so you always know exactly where your project stands.
1
DFM Review
Engineering team reviews your Gerbers, BOM, and assembly drawings for manufacturability risks before production begins.
2
Component Sourcing
All components are procured from authorized channels and pass IQC verification before entering the production floor.
3
SMT & Assembly
Boards are processed through our automated SMT lines, followed by THT, BGA, and box-build stages as required.
4
Test & Ship
100% inspection, functional testing, and final OQC before packaging. Flexible delivery—staged shipments, scheduled releases, and global shipping with full traceability docs.
Buyer Readiness Matrix
Capabilities Matched to RFQ Risk
These are the manufacturing signals buyers usually compare before selecting a PCBA supplier in China.
BGA PCB Assembly
ControlsStencil review, MSL handling, profile validation
InspectionX-Ray sampling or 100%
RFQ InputPitch, package size, void criteria
Prototype & Low Volume
ControlsDFM, first article, setup notes
InspectionAOI + project-specific test
RFQ InputRevision, deadline, repeat quantity breaks
Box Build Assembly
ControlsTorque rules, cable routing, serial labels
InspectionFCT, cosmetic QC, pack-out check
RFQ InputExploded view, labels, accessories, cartons
Consigned / Kitted Builds
ControlsIQC, shortage report, MSL bake rules
InspectionKit match before line release
RFQ InputKit list, attrition allowance, excess return rules
Technical Data
Manufacturing Specifications
Precise parameters and tolerances across our production capabilities.
SMT Assembly
Minimum Component Size01005 (0.4mm × 0.2mm)
Placement Accuracy±25μm (Cpk ≥ 1.67)
Max Component Height25mm
Max Component Size55mm × 55mm
Component Weight (max)5g
Min Lead Pitch (Fine Pitch)0.3mm
Throughput75,000 CPH per line
PCB Handling
Min Board Size30mm × 30mm
Max Board Size560mm × 560mm
Board Thickness Range0.4mm – 6.0mm
Max PCB LayersUp to 32 layers
Min Line / Space3mil / 3mil
Surface FinishesHASL, ENIG, OSP, ENEPIG
Warpage Tolerance≤ 0.7%
Soldering Process
Solder AlloysSAC305, SN63/PB37, Bi-Ag
Reflow AtmosphereNitrogen (O₂ < 500ppm)
Reflow Zones10-zone programmable
Paste Printing Accuracy±12.5μm
SPI Volume Tolerance±10%
Wave Solder FluxNo-Clean / Water-Soluble
Cleanliness StandardIPC-5704 compliant
Testing Capabilities
AOI Resolution15μm pixel resolution
X-Ray Feature SizeSub-micron
ICT Test Points (max)10,000+ nodes
Flying Probe Accuracy±5μm
Thermal Cycling Range-55°C to +125°C
Humidity TestingUp to 95% RH
DPMO (Defect Rate)< 200 DPMO
Scale With Confidence
Production at Any Volume
Whether you need 5 prototype boards or 500,000 units per month, our flexible production scheduling and dedicated NPI cells ensure you get consistent quality at every scale.
50K+
Boards per Day
Capacity
Capacity
5
SMT Lines
In-Service
In-Service
72hr
Prototype
Turnaround
Turnaround
200+
Active Supply
Partners
Partners
Sector Expertise
Industries We Serve
Our team brings deep application knowledge across a wide range of demanding end markets.
Medical Devices
Medical and healthcare electronics support with customer-defined traceability, lot control, and design-freeze documentation requirements.
Automotive
Automotive-related PCBA support with customer-specified AEC-Q requirements, lifecycle sourcing, and change-control records.
Industrial Control
Reliable assembly for PLCs, motor drives, power conversion modules, and HMI systems demanding long service life.
Energy & Power
High-reliability assemblies for solar inverters, EV chargers, battery management systems, and smart grid equipment.
IoT & Consumer
Flexible NPI and mass-production support for connected devices, wearables, and consumer electronics with rapid iteration cycles.
Aerospace & Defense
AS9100D-aware processes, conformal coating, and rigorous traceability for high-reliability avionics and defense hardware.
Telecom & Networking
High-density, high-layer-count PCBAs for switches, routers, base stations, and 5G infrastructure equipment.
R&D & Startups
Engineering-first approach for research institutions and startups — from breadboard to pilot production with expert DFM guidance.
Compatibility
Materials & Component Support
We work with the full spectrum of board materials and component packaging formats — including legacy and exotic types.
PCB Substrate Materials
- FR-4 / High-Tg FR-4Standard and high-temperature variants (Tg up to 170°C)
- Rogers / PTFE LaminatesHigh-frequency RF boards — Rogers 4003C, 4350B, RT/duroid
- Aluminum / Metal Core (MCPCB)High-power LED and power electronics thermal management
- Polyimide (Flex)Kapton-based single and multi-layer flexible circuits
- Rigid-Flex CombinationsMixed rigid-flex stackups for compact, wearable designs
- Ceramic SubstratesAlN and Al₂O₃ for extreme thermal and RF applications
Component Package Support
- SMD Passives01005 to 2512, chip resistors, capacitors, inductors
- IC PackagesSOP, QFP, SOIC, SOT, TO-xxx, DPAK, D²PAK
- Area Array PackagesBGA, PBGA, CBGA, CSP, LGA, flip-chip
- Fine-Pitch ICsQFN, DFN, SON, WLCSP (down to 0.3mm pitch)
- Through-HoleDIP, SIP, connectors, transformers, relays, power modules
- Press-Fit & MixedAutomotive press-fit connectors, mixed SMT/THT assemblies
Ready to Start?
Map your board to the right manufacturing path.
Send Gerbers, BOM, placement data, assembly notes, and the risks you already know. We will review package difficulty, sourcing constraints, test needs, and release records together.