Assembly route
Printing, placement, reflow, through-hole soldering and integration as required. The build plan identifies each operation and any work performed elsewhere.
Manufacturing capabilities
PCBA manufacturing capabilities
in China.
SMT and through-hole assembly, component sourcing, testing and box build. Start with the service scope, then review the requirements for your design.
The quote identifies the manufacturing site, included operations and records for your build.
Assembly
SMT, through-hole and mixed builds
Materials
Turnkey, partial-turnkey or consigned
Delivery
Board assembly through box build
Service scope and build requirements
Use the scope below to identify the work you need. Package, board and test limits are reviewed against the released files before quotation.
| Service | Delivery route | Review before quotation |
|---|---|---|
| SMT / THT assembly | In-house Siemens SMT placement in Dongguan; through-hole and mixed assembly are included according to the build scope. | Released BOM and placement data, package pitch, panel handling, soldering route and inspection. |
| PCB fabrication | Board fabrication is coordinated with the selected PCB fabricator. | Fabricator, stack-up, material, finish, board dimensions and fabrication test records. |
| Component sourcing | Turnkey sourcing, partial sourcing or customer-supplied materials, assigned by BOM line. | Approved manufacturers and sources, substitutions, material ownership and availability. |
| Programming & testing | Programming, inspection and testing follow the quoted project plan. | Name each test method and site, whether performed in-house or by a partner, fixture owner, coverage and report. |
| Box build | PCBA integration with the specified enclosure, cables and subassemblies. | Assembly drawings, supplied parts, mechanical checks and final acceptance. |
Technical requirements to confirm
Package, placement and board limits are confirmed for the quoted design and process route.
Packages & soldering
MPNs, footprints, minimum pitch, component height, MSL handling and thermal constraints. For BGA or fine-pitch parts, include hidden-joint inspection criteria.
PCB & panel
Board dimensions, thickness, stack-up, material grade, panel drawing, rails, fiducials and assembly-side information. Flex and rigid-flex builds also need support and bend details.
Inspection & test
Workmanship criteria, inspection sampling, electrical or functional coverage, fixture responsibility, firmware version and report format.
Quantity & delivery
Prototype and repeat quantities, material availability, required delivery date, packaging and shipment destination.
Agree the process and acceptance plan
Define the route and outputs together so the quotation covers the work needed to release the board.
Inspection coverage
Agree incoming, first-article and workmanship checks. SPI, AOI or X-ray requests need a confirmed method, sampling rule and acceptance criteria.
Test & release
For ICT, FCT or programming, define the fixture, program version and pass/fail log. Agree release responsibility and shipment records.
Equipment and build records
The equipment inventory lists the categories below. The project review confirms the site, current equipment status and the route assigned to your build.
Registered equipment categories
| Equipment type | General process role |
|---|---|
| Siemens SMT placement / solder paste printing | Component placement and solder paste printing. |
| Wave soldering | Through-hole soldering. |
| PCB loader / unloader | Board loading and unloading. |
| Laser engraving | Marking or engraving, subject to the material and marking requirements. |
| Dispensing equipment | Dispensing, subject to material and process requirements. |
Equipment categories do not establish line counts, throughput, package limits or inspection coverage.
Records to agree for the build
| Record | What to include |
|---|---|
| First article | PCB / assembly revision, material checks, workmanship, inspection or test results and disposition. |
| Traceability | Work order, material lots, revision, serial identity and the agreed inspection / test references. |
| Release | Acceptance criteria, approved deviations, sign-off and shipment identification. |
The downloads are planning templates. Completed customer records require approval for redaction and release.
These images illustrate the process. They are not site acceptance evidence or completed customer production records.
From NPI to repeat production
Scheduling depends on released files, material readiness, tooling, test preparation and available line time. Confirm delivery dates in the quotation.
Prototype / NPI
Review the files, close assembly questions and agree first-article checks before the first build.
Pilot build
Check tooling, test coverage, assembly feedback and open deviations before expanding quantity.
Repeat production
Control revisions and materials, maintain the agreed process and records, and confirm each batch schedule.
Materials, packages and related services
Specify the exact laminate and component package. Fabrication, assembly and attachment routes depend on those details.
PCB materials
For FR-4 / high-Tg, RF laminates, metal-core, flex or rigid-flex boards, provide material grade, stack-up and thermal or bend requirements. Other substrates need a specific route review.
Component packages
Provide MPNs and package drawings for passives, fine-pitch ICs, area arrays, through-hole and press-fit parts. Include pitch, height, polarity and assembly constraints.
Send the files you have
Share the current revision and identify what still needs engineering review. An incomplete package can be reviewed with its open items stated.
RFQ inputs
- Gerber or ODB++, BOM and placement data
- Drawings, board / panel dimensions and assembly notes
- Quantity, target date and supply model
- Inspection, testing, firmware and release-record needs
The review should return the proposed scope, open assumptions and information needed for a confirmed quote.