Match assembly limits to layout
Fine-pitch ICs, 0402/0603 passives, BGA/QFN/LGA packages, and connector density are reviewed against process controls.
Manufacturing Capabilities
PCBA Manufacturing Capabilities
in China.
Use this page to connect technical limits, inspection depth, equipment evidence, and volume planning to the decisions in your RFQ package.
Capability principles
Capability only matters when it maps to project risk.
Instead of treating every machine or process as a claim, this page organizes capability around the practical questions buyers ask before release: package difficulty, volume path, test depth, and documentation scope.
Plan prototype to repeat builds
NPI notes, first-article findings, fixture readiness, and material decisions should transfer into stable production.
Define inspection by risk
AOI, SPI, X-ray, ICT, FCT, programming, and coating checks are selected by package type and product use case.
Make capability reviewable
Equipment photos, report samples, process notes, and release packets turn capacity into evidence buyers can inspect.
Core Services
What We Build
A comprehensive suite of assembly and manufacturing services — all under one roof, all held to the same uncompromising standard.
01 Product Definition
Product Concept, Appearance & Structure Design
Support from product idea to industrial appearance direction, enclosure structure, internal stack-up, assembly feasibility, and prototype-ready mechanical files.
02 Prototype / NPI
Prototype & NPI Services
Fast engineering samples with DFM/DFA review, BOM risk feedback, first-article inspection, and production notes that transfer cleanly into pilot builds.
03 SMT Assembly
SMT Assembly
Surface-mount assembly for fine-pitch passives, QFN, BGA, LED, IoT, and industrial boards with controlled printing, placement, reflow, SPI, and AOI checks.
04 THT / Mixed Build
THT / Through-Hole Assembly
Wave, selective, and skilled manual soldering for connectors, terminals, relays, transformers, displays, and high-mechanical-load components after SMT placement.
05 Specialty Assembly
Flex & Rigid-Flex PCB Assembly
Fixture-supported assembly for flexible and rigid-flex boards, including handling control, bend-area protection, controlled reflow, and connector alignment checks.
06 Box Build / Test
Box Build, Testing & Quality Records
Move from assembled boards to product-ready delivery with cable work, enclosure integration, programming, ICT/FCT support, labeling, packing, and release documentation.
Capability-to-Service Links
Match technical capability to the RFQ path buyers search for
These links connect manufacturing capability with the service and industry pages that explain sourcing model, inspection depth, and buyer documentation.
Turnkey PCB Assembly in China
From file review to testing and export logistics, one accountable path for global sourcing teams.
Services
SMT / THT Assembly Services
Surface-mount, through-hole, mixed technology, BGA/QFN, and production assembly scope.
Services
Box Build Assembly
Move from assembled boards to enclosure, cable, label, package, and final product integration.
Services
BGA PCB Assembly
Define inspection evidence, void limits, and shipment release records for hidden-joint assemblies.
Services
Industrial Control PCBA
High-mix, long-lifecycle boards for PLC, power, gateway, sensor, and automation products.
Services
Medical Device PCBA
Traceability, FOD control, inspection records, and test packets for regulated electronics.
Services
RFQ Package Checklist
Gerber, BOM, centroid, drawings, quantities, test requirements, and delivery notes.
Services
Automotive PCBA Manufacturing
Lifecycle change control and release documentation support for vehicle electronics.
Services
Prototype PCB Assembly
Engineering-first production for fast validation, ECO traceability, and smooth pilot transitions.
Services
Consigned / Kitted PCB Assembly
Mixed-supply flow with incoming inspection, shortage feedback, and substitution control.
Services
Factory Evidence
Manufacturing Capabilities Buyers Can Verify
This section turns capability claims into checkable production facts: line setup, inspection path, test scope, and the evidence assets that should be attached when available.
FacilityDongguan electronics manufacturing site, stated as Dongguan facility on the site.
SMT capacitySMT assembly capacity with screen printing, placement, reflow, SPI/AOI process checks.
Assembly rangeSMT, THT, BGA/QFN/LGA, flex/rigid-flex, prototype, low-volume, and repeat builds.
Test pathAOI/SPI, X-ray planning, ICT/FCT, programming, fixture and release record support by project scope.
Capability
What a buyer can ask to verify
Evidence window
SMT line
Line photo, equipment nameplate, feeder setup photo, reflow profile example, first-article checklist.
SMT line, printer, SPI, or station photos.
BGA / Fine pitch
Package list, stencil review note, MSL handling rule, X-ray sampling or 100% inspection criteria.
X-ray image and hidden-joint inspection report.
ICT / FCT
Fixture photo, test procedure cover page, pass/fail log format, programming version control.
Test bench, fixture photo, and pass/fail log example.
Case scene
Representative project type, quantity range, inspection depth, test scope, and release packet example.
Anonymized case scenario and release record example.
Representative photos are used here for capability review. For customer RFQs, attach project-specific line, fixture, inspection, or release-record evidence when available.
Buyer Evidence Pack
Review the Records Behind the Build Plan
Use published reference cases and field templates to define the evidence your project needs. Completed customer records are shared only when the program owner has approved redaction and release. For workmanship-class planning, use the IPC Class 2 vs Class 3 PCBA Decision Guide + RFQ Worksheet.
Engineering Resource Library + Project Cases + Templates
Review 52 reference architectures with engineering risks, validation plans, production controls, and evidence-packet guidance. Each page identifies its reference scope.
Browse cases
First-Article Inspection Checklist
Download a planning template for revision control, materials, workmanship, dimensions, inspection, test, disposition, and release approval.
Download CSV template
Traceability Field Sample
Review example fields for work order, PCB and assembly revision, material lot, date code, line, inspection, test, serial identity, and shipment release.
Download XLSX template
Redacted X-Ray / AOI Record Request
Ask engineering for a project-relevant, release-approved example. Public representative imagery is not presented as a completed customer inspection report.
Request evidence
Published Equipment Models
Review the stated Yamaha YSM40R placement and DEK Horizon printing equipment, alongside the process and evidence boundaries buyers should verify.
Review equipment
Quality and Release Controls
Connect the inspection evidence request to incoming control, SPI/AOI, hidden-joint review, functional test, and release documentation scope.
Review controls
Equipment Proof
Equipment List and Machine Evidence Windows
Buyers can use this section to understand what proof is useful during capability review: equipment category, process role, inspection method, and photo evidence where project details can be shared.
Equipment category
Details buyers should verify
Evidence window
SMT line set
Printer, SPI, mounter, reflow, AOI model, quantity, line number, board size range, and maintenance/calibration status.
Line panorama + equipment nameplates.
X-Ray / BGA inspection
Machine model, inspection mode, image output format, sampling rule, void/bridge acceptance note, and reviewer role.
X-ray station photo + anonymized BGA image.
ICT / FCT / programming
Fixture type, supported node count or test scope, firmware/version control, pass/fail log example, and release criteria.
Fixture/test bench photo + log screenshot.
Material control
MSL storage, baking equipment, incoming inspection tools, ESD controls, reel/kitting workflow, and lot traceability fields.
Warehouse/MSL cabinet/IQC photos.
Do not publish serial numbers or customer program details if they are sensitive. Keep enough data visible for buyers to verify process maturity: category, model family, date, line/station, and acceptance status.
Facility Deep Dive
Inside Our Manufacturing Lines
Production lines configured around documented process control, inspection, and the requirements agreed for each build.
SMT Lines
SMT Assembly Capacity
Our SMT assembly capacity support screen printing, placement, reflow, and inspection. The exact routing, data capture, and verification plan are confirmed against the product and release requirements.
- Yamaha YSM40R placement machines
- DEK Horizon screen printers with vision alignment
- Reflow profiles reviewed for the build
- Process records available where specified
- Traceability scope agreed by project
Testing & Inspection
Multi-Stage Verification at Every Step
Inspection is planned around package risk, test access, product maturity, and the agreed acceptance criteria. Applicable AOI and X-ray findings are reviewed and fed back into process control.
- Post-reflow AOI where required by the build route
- X-ray sampling or 100% criteria agreed for hidden joints
- Flying probe or ICT where test access and volume justify it
- Customer-defined FCT when limits and fixtures are available
- Burn-in and environmental screening when specified
Supply Chain
Trusted Global Component Sourcing
The sourcing plan identifies approved channels, traceability requirements, lifecycle risks, and customer-controlled parts before purchase. Named sources are confirmed against the released BOM.
- Authorized distributor partnerships
- Anti-counterfeit verification (AS6081)
- MSD baking per JEDEC J-STD-033
- Bonded inventory program available
- Long-lead-time risk mitigation planning
From Order to Delivery
Our Production Workflow
A milestone-driven process shows the current stage, owner, and next decision.
DFM Review
Engineering team reviews your Gerbers, BOM, and assembly drawings for manufacturability risks before production begins.
Component Sourcing
Approved sourcing channels, customer-supplied parts, alternates, and incoming checks are defined in the BOM and sourcing plan before production.
SMT & Assembly
Boards are processed through our automated SMT lines, followed by THT, BGA, and box-build stages as required.
Test & Ship
Agreed inspection, functional testing, and final OQC are completed before packaging. Delivery and traceability records follow the approved release plan.
Buyer Readiness Matrix
Capabilities Matched to RFQ Risk
These are the manufacturing signals buyers usually compare before selecting a PCBA supplier in China.
BGA PCB Assembly
ControlsStencil review, MSL handling, profile validation
InspectionX-Ray sampling or 100%
RFQ InputPitch, package size, void criteria
Prototype & Low Volume
ControlsDFM, first article, setup notes
InspectionAOI + project-specific test
RFQ InputRevision, deadline, repeat quantity breaks
Box Build Assembly
ControlsTorque rules, cable routing, serial labels
InspectionFCT, cosmetic QC, pack-out check
RFQ InputExploded view, labels, accessories, cartons
Consigned / Kitted Builds
ControlsIQC, shortage report, MSL bake rules
InspectionKit match before line release
RFQ InputKit list, attrition allowance, excess return rules
Technical Data
Manufacturing Specifications
Planning ranges for typical programs. Final limits are confirmed through DFM, equipment loading, and supplier review before release.
SMT Assembly
Minimum Component Size0402 (1.0mm × 0.5mm), subject to DFM review
Placement AccuracyProcess capability reviewed by package and board design
Component EnvelopeConfirmed against current machine, feeder, and tooling limits
Min Lead Pitch (Fine Pitch)0.4mm and above, subject to package and stencil review
ThroughputQuoted from placement count, changeover, test, and product mix
PCB Handling
Board EnvelopeConfirmed from panel drawing, conveyor clearance, and tooling review
Thickness and Stack-upConfirmed by fabrication and assembly review
Layers and GeometryConfirmed against the selected PCB fabricator's current capability
Surface FinishesHASL, ENIG, or OSP; confirmed per project
Warpage AcceptanceDefined by board design, assembly risk, and customer criteria
Soldering Process
Solder AlloysSAC305, SN63/PB37, Bi-Ag
Reflow AtmosphereAir or nitrogen where the approved process requires it
Profile ControlRecipe and measurement plan confirmed for the build
Paste and SPI LimitsSet from stencil design, package risk, and acceptance criteria
Wave Solder FluxNo-Clean / Water-Soluble
CleanlinessRequirement and verification method agreed by project
Testing Capabilities
AOI and X-rayCoverage and criteria agreed from package and process risk
ICT and Flying ProbeAccess, fixture, coverage, and limits reviewed per product
Environmental TestRange, duration, loading, and acceptance criteria supplied or agreed
Quality MetricsBaseline and reporting method defined for the released build
Scale With Confidence
Capacity Confirmed for Your Build
Prototype and repeat-production capacity are confirmed after reviewing placement count, process route, test time, material readiness, and the requested delivery plan.
RFQ
Release volume
confirmed
confirmed
Plan
Line allocation
confirmed
confirmed
NPI
Prototype timing
after review
after review
BOM
Approved sources
and alternates
and alternates
Sector Expertise
Industries We Serve
Our team brings deep application knowledge across a wide range of demanding end markets.
Medical Devices
Medical and healthcare electronics support with customer-defined traceability, lot control, and design-freeze documentation requirements.
Automotive
Automotive-related PCBA support with customer-specified AEC-Q requirements, lifecycle sourcing, and change-control records.
Industrial Control
Reliable assembly for PLCs, motor drives, power conversion modules, and HMI systems demanding long service life.
Energy & Power
High-reliability assemblies for solar inverters, EV chargers, battery management systems, and smart grid equipment.
IoT & Consumer
Flexible NPI and mass-production support for connected devices, wearables, and consumer electronics with rapid iteration cycles.
Aerospace & Defense
AS9100D-aware processes, conformal coating, and rigorous traceability for high-reliability avionics and defense hardware.
Telecom & Networking
High-density, high-layer-count PCBAs for switches, routers, base stations, and 5G infrastructure equipment.
R&D & Startups
Engineering-first approach for research institutions and startups — from breadboard to pilot production with expert DFM guidance.
Compatibility
Materials & Component Support
We work with the full spectrum of board materials and component packaging formats — including legacy and exotic types.
PCB Substrate Materials
- FR-4 / High-Tg FR-4Standard and high-temperature variants (Tg up to 170°C)
- Rogers / PTFE LaminatesHigh-frequency RF boards — Rogers 4003C, 4350B, RT/duroid
- Aluminum / Metal Core (MCPCB)High-power LED and power electronics thermal management
- Polyimide (Flex)Kapton-based single and multi-layer flexible circuits
- Rigid-Flex CombinationsMixed rigid-flex stackups for compact, wearable designs
- Ceramic SubstratesAlN and Al₂O₃ for extreme thermal and RF applications
Component Package Support
- SMD Passives0402 to 2512, chip resistors, capacitors, inductors
- IC PackagesSOP, QFP, SOIC, SOT, TO-xxx, DPAK, D²PAK
- Area Array PackagesBGA, PBGA, CBGA, CSP, LGA, flip-chip
- Fine-Pitch ICsQFN, DFN, SON, WLCSP (down to 0.3mm pitch)
- Through-HoleDIP, SIP, connectors, transformers, relays, power modules
- Press-Fit & MixedAutomotive press-fit connectors, mixed SMT/THT assemblies
Ready to Start?
Map your board to the right manufacturing path.
Send Gerbers, BOM, placement data, assembly notes, and the risks you already know. We will review package difficulty, sourcing constraints, test needs, and release records together.