Zero Defects.
Absolute Reliability.
Quality isn't just a department; it's embedded in our DNA. From incoming material verification to final functional testing, we employ strict multi-stage inspection protocols to ensure your products perform flawlessly.
Certified Excellence
Our facility operates under strict international quality management systems, ensuring compliance across various demanding industries.
ISO 9001:2015
Foundation of our Quality Management System (QMS), ensuring consistent product quality and continuous improvement.
ISO 13485:2016
Certified for Medical Device manufacturing, guaranteeing traceability, risk management, and strict process controls.
IATF 16949:2016
Automotive industry standard focusing on defect prevention, reducing variation, and waste in the supply chain.
RoHS & REACH
Fully compliant with environmental directives, offering lead-free manufacturing and hazardous substance control.
Our Quality Control Flow
We leave nothing to chance. Every stage of the manufacturing process is monitored, inspected, and recorded.
IQC Incoming Quality Control
Before any component enters our inventory, it undergoes strict verification. We check for authenticity, date codes, physical damage, and perform electrical value testing using LCR meters. We also bake moisture-sensitive components (MSD) according to JEDEC standards.
SPI Solder Paste Inspection
After screen printing, 100% of boards pass through our 3D SPI machines. This ensures the volume, area, height, and shape of the solder paste are perfect, preventing 70% of potential soldering defects before component placement.
IPQC & AOI In-Process & Automated Optical Inspection
First Article Inspection (FAI) is mandatory for every run. Post-reflow, our inline 3D AOI systems scan every board for missing components, polarity issues, tombstones, and solder joint quality with micron-level accuracy.
X-Ray Inspection For BGA & QFN Packages
For components with hidden solder joints (BGA, QFN, CSP), we utilize high-resolution 2D/3D X-Ray inspection to detect voids, bridging, and cold solder joints that optical cameras cannot see.
ICT & FCT In-Circuit & Functional Testing
We verify the electrical integrity of the board using Flying Probe or Bed-of-Nails ICT. Finally, Custom Functional Testing (FCT) simulates the product's real-world operating environment to ensure 100% functional compliance.
OQA Outgoing Quality Assurance
Before packaging, a final visual and documentation check is performed. Products are packed in ESD-safe, vacuum-sealed bags with desiccants to ensure they arrive at your facility in pristine condition.
Advanced Inspection Equipment
Koh Young 3D SPI
Industry-leading 3D Solder Paste Inspection ensuring precise solder volume measurement to eliminate printing defects.
Omron 3D AOI
High-speed, high-resolution Automated Optical Inspection for post-reflow defect detection with minimal false calls.
Dage X-Ray System
Sub-micron feature recognition for inspecting complex BGA, CSP, and flip-chip packages for voids and shorts.
Flying Probe Testers
Fixtureless testing for prototypes and low-volume production, providing rapid electrical verification.
Environmental Chambers
Thermal cycling and humidity testing chambers to ensure product reliability under extreme environmental conditions.
MES Traceability
Full Manufacturing Execution System integration. Every board is barcoded, allowing component-level traceability.
Experience Uncompromising Quality
Don't let poor manufacturing quality compromise your brand. Partner with us for reliable, certified, and traceable PCBA manufacturing.
Request a Quality Audit