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Low-Power Temperature and Humidity Sensor PCBA
An FCC-photo reference showing a compact sensor node with a TI CC2652-marked wireless device, 48 MHz crystal, programming pads, a board-edge key, RF matching, and a printed antenna.
Project context
A representative engineering program
An FCC-photo reference showing a compact sensor node with a TI CC2652-marked wireless device, 48 MHz crystal, programming pads, a board-edge key, RF matching, and a printed antenna.
System architecture
How the electronics are organized
A representative coin-cell node periodically wakes a low-power 2.4 GHz MCU, samples an environmental sensor and battery voltage, applies calibration and change thresholds, transmits briefly to a gateway, and returns to deep sleep.
Engineering risks to close
What must be resolved before release
- Minimize sleep leakage and retry energy while preserving responsive sensing and rejoin behavior.
- Limit measurement error from MCU, battery, crystal, enclosure, and user self-heating.
- Maintain antenna tuning near the battery, wall, hand, and final enclosure without blocking the sensing vent.
Validation plan
Evidence expected before production
- Run multi-point temperature and humidity calibration, hysteresis, response-time, condensation-recovery, and drift tests.
- Profile sleep current, wake and transmit peaks, low-voltage behavior, weak-network retries, and projected battery life.
- Verify final-enclosure antenna efficiency, sensitivity, key ESD, drop, vibration, and production RF packet testing.
Decision-ready evidence packet
What a comparable RFQ should define
This checklist turns the technical story into reviewable inputs and release records. It describes what buyers and manufacturers should agree—not a claim that every listed record applies to every build.
Design baseline
Released schematic or block diagram, interface table, power states, critical constraints, and revision owner.
Manufacturing release
Gerber or ODB++, stack-up, centroid data, assembly drawings, approved DFM dispositions, and panel assumptions.
Material control
Released BOM revision, manufacturer part numbers, AVL or alternate rules, no-substitute lines, MSL handling, and exception approvals.
Validation record
Test method, acceptance criteria, sample or serial identity, measured result fields, and disposition. Example scope: Run multi-point temperature and humidity calibration, hysteresis, response-time, condensation-recovery, and drift tests.
Production release
First-article status plus the agreed SPI, AOI, X-ray, ICT, FCT, programming, rework, OQA, labeling, and packing records.
Project-specific fields, retention periods, sampling rules, measured limits, and customer approvals are confirmed during RFQ and protected under the applicable confidentiality agreement.
Development and production controls
Manufacturing scope represented here
- Ultra-low-power environmental sensing.
- 2.4 GHz board-antenna integration.
- Calibration and threshold reporting.
Technical image review
Board-level evidence
White-background views are published to make component placement, interfaces and assembly boundaries easier to inspect.
