Reliability is the product of design, materials, and process. PCBA PARTNER encourages manufacturability thinking at NPI—not rework after mass production fails.
Design phase
Place test points and fiducials thoughtfully; plan shielding and return paths for analog/RF; avoid large BGAs beside fine-pitch devices in high-stress zones.
Materials and storage
Bake and store MSL parts per spec; expired paste and oxidized pads sharply increase open-joint risk.
Process control
- Layer SPI, AOI, and X-Ray for risk-based coverage
- Calibrate placement and reflow equipment on schedule
- Code defects at rework and feed back to process and incoming quality
Test and validation
Beyond FCT, consider burn-in, temperature cycling, or cross-section sampling by product class. Medical and industrial customers often need long-term failure modes defined up front.