IPC class
Identify the applicable workmanship standard and revision, cosmetic requirements, void limits where relevant, test coverage, labeling, and packaging.
Quality Assurance
Define PCBA inspection and test requirements
Specify the workmanship criteria, inspection coverage, test limits, and records required for your build.
How acceptance criteria are agreed
Before the line
Agree acceptance criteria and quality records
Review the ISO 9001:2015 certificate below, then specify the product and process requirements that apply to your order.
Lots and MSL
Define the required component lot references, substitution approvals, moisture-sensitive handling records, and customer-supplied kit records.
SPI, AOI, X-ray
Specify any in-circuit testing (ICT), functional testing (FCT), coating inspection, or programming checks required for the product.
Shipment quality records
Agree which outgoing inspection records, test summaries, photos, and packing notes are to accompany the shipment.
Review the available evidence
Check the certificate and capability information, then use the templates to define the records your project needs.
These templates define record fields; they are not completed customer reports. Project records require the agreed scope and approval for sharing.
End-to-End Control
Quality checks from incoming inspection to release
Before production, define the inspection criteria, material and process checks, any risk-based tests, and release records for the order. The images are illustrative; actual inspection scope and records are agreed per project.
1
IQC Incoming Quality Control
Set incoming checks against the approved BOM, customer-supplied material details, date-code requirements, condition, and MSL handling. Agree which lot references and exceptions to record.
2
SPI Solder Paste Inspection
If SPI is available and included in the agreed scope, define measurement limits for solder volume, area, height, and print shape, along with the report required. SPI can help identify print variation before placement and reflow.
3
IPQC & AOI In-Process & Automated Optical Inspection
Confirm AOI availability before quotation. If included in scope, agree first-article and post-reflow coverage for visible features, then define how findings and rework decisions are recorded.
Illustrative optical-inspection setup
4
X-Ray Inspection For BGA & QFN Packages
For BGA, QFN, CSP, and other hidden-joint packages, confirm X-ray availability first. If selected, agree the inspection scope, sampling rule, acceptance criteria, and report before order approval.
5
ICT & FCT In-Circuit & Functional Testing
Provide electrical and functional test requirements for review. Confirm feasibility, test access, fixture, firmware, cost, pass/fail limits, and required logs before including tests in the order.
6
OQA Outgoing Quality Assurance
Define which outgoing checks apply, including visual condition, documents, labels, ESD packaging, desiccants where needed, and shipment release. Agree the records required for the batch handoff. Use the PCBA Export Packaging Standard + Inspection Checklist to align pack-out evidence, labels, release records, and receiving acceptance before shipment.
Test fixture planning
Match the fixture to the board.
Test-point access, board support, connector interfaces and acceptance limits belong in the test plan.
For a fixture-based build, share your board revision, test specification and programming requirements with the RFQ.
Discuss your test requirements →Buyer Documentation
Quality records to define for the order
For medical, automotive, industrial, or BGA assemblies, identify which inspection, test, traceability, and release records are required for the lot. Use the IPC Class 2 vs Class 3 PCBA Decision Guide + RFQ Worksheet to align the IPC class with those requirements.
Material & Lot Traceability
The RFQ can specify component lot references, approved substitutions, incoming-check notes, MSL handling status, and customer-supplied kit receipts.
BGA and hidden-joint inspection
Confirm X-ray availability first. If selected, define the sampling plan, acceptance criteria, and image-report format at RFQ stage.
Change Control Records
List the BOM, firmware, label, process, and test-fixture changes that need approval and a retained record.
Test & Release Packets
Specify whether first-article, ICT/FCT, rework, outgoing-inspection, or packaging records are needed; confirm test and reporting scope before order approval.
Define the records you need
Planning templates, not completed customer test reports. Project records are agreed separately.
First article
Use a checklist to define the pilot-lot review.
Download checklist · CSV →Traceability
Specify the identity fields and export format required.
Download field template · XLSX →Test plan
Define coverage, acceptance limits and the release log.
Download test plan · XLSX →Certificate document
ISO 9001:2015 certificate document
The document below names Dongguan Hepin Electronic Technology Co., Ltd. and lists its printed ISO 9001:2015 scope. Its printed validity is subject to surveillance audits; confirm current status with the issuer before supplier approval.
Certificate details
Certificate document details
The document lists R&D, production, and sales of PCBA boards for Dongguan Hepin Electronic Technology Co., Ltd., the legal entity operating the PCBA PARTNER brand.
- Standard
- GB/T 19001-2016 / ISO 9001:2015
- Certificate No.
- 2070025Q10649R0S
- Printed issue date
- December 31, 2025
- Printed validity
- December 30, 2028, subject to surveillance audits
- Entity named on document
- Dongguan Hepin Electronic Technology Co., Ltd.
- Certification body named on document
- Guangdong Zhongzhijian Certification Co., Ltd.
Project-specific quality requirements
The following describe support areas, not additional company certifications. Required qualification and compliance evidence must be agreed for your project.
Medical Traceability Support
Specify lot identification, change control, documentation, and supplier qualification requirements for review.
Automotive Quality Planning
State the required supplier approvals, component qualifications, change controls, and production records in the RFQ.
RoHS & REACH
Material controls for lead-free builds and restricted-substance requirements when specified.
Records to agree
Records you can ask for
The images below are illustrative, not project records. For each order, agree the inspection or test step, acceptance criteria, and report needed for quotation, first-article review, or shipment.
- Inspection evidence is scoped before quote approval.AOI, X-ray, ICT, FCT, coating, and outgoing inspection records are selected according to package risk, IPC expectations, and customer acceptance criteria.
- Records are tied to lot, revision, and material decisions.Useful packets should identify BOM revision, approved substitutions, MSL handling, fixture version, firmware version, and release status.
- Define the record format for each order.Use approved samples or templates as references. Images on this page are illustrative, not production records; agree project evidence separately for each order.
Control point
Record or evidence to verify
When it is used
IQC / Material
Incoming inspection notes, component lot references, MSL baking/storage status, consigned kit receiving record.
Turnkey, consigned, medical, automotive, and long-lifecycle programs.
SPI / AOI
Solder paste inspection output, first-article approval, post-reflow AOI defect classification, rework disposition.
SMT lots, fine-pitch ICs, dense boards, NPI, and repeat production.
X-Ray
BGA/QFN image sample, void or bridge finding, inspection sampling rule, customer acceptance note.
Hidden-joint packages or buyer-defined reliability risk.
ICT / FCT
Fixture version, test procedure, pass/fail log, firmware/programming version, functional release note.
Products with electrical test requirements, firmware, connectors, sensors, power, or final box build.
Inspection methods to confirm
Inspection and test methods
Select inspection and test methods according to package geometry, test access, and the agreed acceptance criteria.
3D solder-paste inspection (SPI)
If 3D SPI is considered for the build, confirm availability and agree the measurement limits and records before quotation.
Optical inspection (AOI)
Confirm AOI availability before quotation. If included in scope, agree post-reflow coverage for visible components and solder-joint features. Coverage depends on the inspection program and joint visibility.
X-ray inspection for hidden joints
For hidden-joint packages, confirm whether X-ray inspection is available and agree scope, sampling, and acceptance criteria before order approval.
Flying-probe / ICT test planning
Before quotation, assess whether flying-probe or fixture-based ICT is available and suitable for the quantity, test access, and released test plan. Confirm coverage, cost, and records. Use the PCBA test planning guide and editable test plan template to define requirements and responsibilities.
Environmental test planning
Specify thermal, humidity, or aging test conditions and required reports. Confirm test availability, responsible laboratory, cost, and schedule before including these tests in the order.
Traceability requirements
Specify the barcode, lot, process, inspection, and release fields needed, then agree how any records will be captured and supplied. Use the PCBA traceability data guide to define the required field set, compare ICT, FCT, and flying-probe strategy, and review case-level validation plans.
Discuss your inspection and record requirements
Include acceptance criteria and required reports so the inspection scope and project records can be reviewed.